|本期目录/Table of Contents|

[1]卢 霞.一种SMT生产缺陷自动检测系统的设计与实现[J].工业仪表与自动化装置,2014,(05):55-58.
　LU Xia.Design and implementation of an automatic detection system for SMT manufacturing dDefects[J].Industrial Instrumentation & Automation,2014,(05):55-58.
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一种SMT生产缺陷自动检测系统的设计与实现(PDF)

《工业仪表与自动化装置》[ISSN:1000-0682/CN:61-1121/TH]

卷:
期数:
2014年05期
页码:
55-58
栏目:
出版日期:
2014-10-15

文章信息/Info

Title:
Design and implementation of an automatic detection system for SMT manufacturing dDefects
作者:
卢 霞
（1.兰州工业学院 软件工程学院，兰州 730050；2.中国蓝星（集团）总公司，北京 100029）
Author(s):
LU Xia
(Software Engineering School, Lanzhou Institute of Technology, Lanzhou 730050,China）
关键词:
SMT; 生产缺陷; 检测; 图象处理
Keywords:
SMT;  manufacturing defects;  detection;  image processing
分类号:
TP29
DOI:
-
文献标志码:
A
摘要:
为了控制PCB成品质量，设计和实现了对SMT生产缺陷的自动检测。采用定位、摄像和图像处理等技术，精确检测和标识PCB产品的缺陷。系统运行可靠，降低了SMT生产成本。
Abstract:
The quality of PCB products is controlled by designing and implementing automatic detection of SMT manufacturing defects. Defects of PCB products are precisely detected and identified by adopting location, photograph and image processing technology. The whole system is stable and low-cost in run.

参考文献/References:

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[2] 吴平峰,代宣军.PCB测试技术的介绍[J].现代机械, 2009(4): 90-93.
[3] 林俊.基于梯度的动态分块迭代阈值图像二值化方法[J].光学与光电技术,2006,4(5): 132-137.
[4] ACCIANI G, BRUNETTI G, FORNARELLI G. Application of neural networks in optical inspection and classification of solder joints in surface mount technology[J]. IEEE Transactions on Industrial Inf ormatics, 2006, 2(3): 200-209.
[5] 吴黎明,崔山领,王立苹,等.重复图案晶片自动检测新方法[J].光学精密工程,2008,16(5): 925-930.

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备注/Memo

备注/Memo:
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更新日期/Last Update: 1900-01-01