th.2022.03.022]
点击复制

基于CFD的数据机房热环境模拟研究

《工业仪表与自动化装置》[ISSN:1000-0682/CN:61-1121/TH]

Title:: Research on Thermal Environment Simulation of Data Room Based on CFD

Author(s):: SU Yang; YU Xuan; LU Xiang; Guizhou Power Grid Co., Ltd., Guiyang 550003

摘要:: 针对企业数据中心(EDC)机房热环境模拟的需求，文章在基本控制方程及湍流近似模型的基础上，引入了RNGk-ε算模型，解决工程常用的标准k-?型在压力梯度较强的复杂湍流应用场景下精度较差的问题，用于以机房为对象的温度场仿真；为更进一步准确模拟机柜内热环境，以机柜为对象进行建模，并利用上述理论进行温度场仿真；通过集成控制系统完成机房内温度数据监测并与仿真数据对比，在以机房为研究对象的热环境模拟中，所使用方法达到了95%以上监测点温度误差在1.5 ℃内的效果，在以机柜为研究对象的仿真中，机柜内最高温度误差为1 ℃。并进行了280小时的连续工作验证实验，证明所使用仿真方法能够有效地完成机房及机柜的热环境模拟。

Abstract:: According to the requirements of thermal environment simulation of enterprise data center (EDC) computer room, RNG?-?model was introduced based on the basic control equation and turbulence approximation model, which was used for the temperature field simulation of the computer room The calculation model was used to solve the problems that the accuracy of the model was poor in the complex turbulence application scenario with strong pressure gradient commonly cased the standard k-?model, which commonly used in engineering; In order to further accurately simulate the thermal environment in the cabinet, it was proposed to model the cabinet and simulate the temperature field by using the proposed theory; Through the integrated control system, the temperature data in the machine room was monitored and compared with the simulation data. In the thermal environment simulation with the machine room as the research object, the method used achieves the effect that the temperature error of more than 95% of the monitoring points is within 1.5 ℃. In the simulation with the cabinet as the research object, the maximum temperature error in the cabinet is 1 ℃. The 280 hours continuous working experiments show that the simulation method can effectively complete the thermal environment simulation of machine room and cabinet.

[1]邓科,张守勋,张焕青,等.基于CFD的机房热环境的数值模拟与优化[J].自动化与仪器仪表,2018(07):170-173.

[2]王宁,陈龙泉,蔡丰,等.冷通道封闭对机房热环境影响的实验和模拟[J].暖通空调,2017,47(06):107-112+116.

[3]王丹华,邱燕,张冠敏,等.设备布局对机房热环境影响的模拟研究[J].建筑节能,2016,44(11):18-21.

[4]赵永柱,张忠浩,陈果,等.基于计算流体动力学模型的机房温度及空调节能仿真[J].计算机应用,2020,40(S1):243-247.

[5]周拓. IDC机房典型送风方式气流组织研究[D]. 西安：西安电子科技大学,2018.

[6]李倩.通信机房热环境的模拟及测量方式的改进[D].青岛：中国海洋大学,2014.

[7]De-Risking Data Center Temperature Increases, Part 1[J] . Beaty, Donald L,Quirk, David.??ASHRAE Journal . 2016 (1)

[8]韩腾,熊建国,邓晶,等.竖壁贴附通风供热模式水平贴附射程及热环境特性CFD模拟[J/OL].暖通空调:1-8[2021-08-29].http: //kns.cnki.net/ kcms/detail/ 11.2832.TU. 20210726. 1041. 030.html.

[9]王洪利,徐鸿昌.空调房间热环境实测与模拟[J].华北理工大学学报(自然科学版),2021,43(02):72-80.

[10]吴捷刚. 基于CFD的秋季蛋鸡舍环境评估与优化研究[D].杭州：浙江大学,2021.

[11]谭星宇,谢贤平,赵艳艳.喷浆支护掘进工作面通风热环境数值模拟[J].安全与环境学报,2021,21(02):576-582.

[12]蔡丰.机房热环境的数值模拟与实验研究[D].武汉：武汉工程大学,2017.

更新日期/Last Update: 1900-01-01