|本期目录/Table of Contents|

[1]谢华燕.FCS系统在贴片机的位置偏差校正中的应用[J].工业仪表与自动化装置,2015,(01):125.
 XIE Huayan.Application of FCS in chip mounter position deviation correction[J].Industrial Instrumentation & Automation,2015,(01):125.
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FCS系统在贴片机的位置偏差校正中的应用(PDF)

《工业仪表与自动化装置》[ISSN:1000-0682/CN:61-1121/TH]

卷:
期数:
2015年01期
页码:
125
栏目:
出版日期:
2015-02-15

文章信息/Info

Title:
Application of FCS in chip mounter position deviation correction
文章编号:
20150018
作者:
谢华燕
(兰州职业技术学院 电子与信息工程系,兰州 730070)
Author(s):
XIE Huayan
(Department of Electronic and Information Engineering, Lanzhou Vocation Technology College, Lanzhou 730070,China)
关键词:
贴片机激光识别FCS系统偏差校正PCB
Keywords:
chip mounter laser recognition flexible calibration system(FCS) bias correction printed circuit board(PCB)
分类号:
TP2
DOI:
-
文献标志码:
A
摘要:
准确的定位技术是SMT表面组装生产线上主流设备贴片机的主要性能指标,贴片机的定位系统成为高性能贴片机最为关键的系统之一。以激光校准传感器作为贴片机的视觉定位检测系统,使贴片机自身具有识别贴片位置偏移的自动校正功能,满足小型元件的贴片精度要求,且提高对θ轴马达的强化,实现了面向大型元件的对应能力。结果表明:激光识别自动校正系统FCS在贴片头中的应用,通过非接触定心方式,LED激光多角度照射,光影宽度与切线数据的获取,使用最小拟合二乘法准则完成元件形状分析,位置偏差校正,实现贴片元件精准定位的工艺要求。
Abstract:
Accurate positioning technology is the main performance indicators mainstream SMT production line equipment placement machine, Chip mounter positioning system has become one of the most critical system performance chip mounter. Laser calibration of the sensor as a visual location detection system chip mounter, so placement machine itself has an identification patch positional shift automatic correction features to meet the requirements of small component placement accuracy, and improve and strengthen the θ axis of the motor, the ability to achieve a correspondence for large components. The results showed that: automatic calibration of flexible calibration system(FCS) in the attached application, by way of a non-contact centering, Light-emitting diode(LED) multi-angle laser light, shadow width tangent data acquisition, Using the minimum criteria for the completion of fitting two multiplication element shape analysis, correcting positional deviation, SMD components to achieve precise positioning process requirements.

参考文献/References:

[1] 龙绪明.现代实用电子SMT设计与制造技术[M].北京.电子工业出版社,2002,170-181.[2] 杜轩,李宗斌,等.基于遗传算法的转塔式贴片机贴装过程优化[J].西安交通大学学报,2008,42(3);295-299.[3] 田福厚,李少远.贴片机喂料器分配的优化及其遗传算法的求解[J].控制与决策,2005,20(8);955-958.[4] Wu H H, Zhang X M, Kuang Y C, et al. A Real-time Machine Vision System for Solder Paste Inspection// IEEE/ ASME International Conference on Advanced Intelligent Mechatronics, 2008;205-210.[5] DavidR,Halk.A Review of the Advanced Packaging Technologies [J].SMT.1997:60-66.[6] 袁鹏,胡跃明,等.贴片机屏蔽罩视觉定位算法研究[J].计算机测量与控制,2009,17(6):1141-1174.[7] 鲜飞.贴片机视觉系统综述[C]. 张家界:中国高端SMT学术议论文集, 2007:139-145.[8] 曾又姣,金烨.基于遗传算法的贴片机顺序优化[J].计算机集成制造,2004;10(2):206-209.[9] 王姗,高红霞.表面贴装元件识别的一种亚像素边缘检测方法[J].半导体技术,2007,32(3):259-262.[10] 清华大学电子实习教研组.SMT表面贴装实习系统使用手册[M].北京:清华大学,2005.

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备注/Memo

备注/Memo:
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更新日期/Last Update: 1900-01-01